Semiconductor Engineering

Wafer Probe Struggles To Adapt To Multi-Die Assemblies

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
Semiconductor Engineering

Need For KGD Drives Singulated Die Screening

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
DIGITIMES

HTSI gets boost from probe cards and engineering services

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes ...
EDN

ChipMOS achieves DRAM wafer test speed-up

HSINCHU, Taiwan – ChipMOS Technologies (Bermuda) Ltd., a Taiwanese provider of semiconductor testing and assembly services, has developed a wafer tester for probe testing 32 in parallel double data ...
Nasdaq

Aehr Receives First Order for FOX(TM) Wafer Level Test and Burn-in System to be used for Gallium Nitride Semiconductor Engineering and Qualification

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...
Optics

Singapore-Taiwan duo collaborate on silicon photonics wafer testing

CompoundTek, the silicon photonics wafer foundry based in Singapore, has agreed a strategic collaboration with Taiwan's STAr Technologies that will aim to speed the technology’s move to large-scale ...
Morningstar

Aehr Test Systems Announces Wafer Level Burn-in and Test Application Evaluation Order from Leading AI Processor Supplier

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order ...